SALANG SW-1000 SERIES
Confocal, white-light interferometry and focus variation cover 3D measurement tasks from ultra-smooth mirror surfaces to rough surfaces, steep slopes and complex microstructures. Choose the measurement method that fits the sample surface, structural height and analysis goal, then complete roughness, step-height, 3D profile and surface-feature analysis on the same platform.
01 / Product Positioning
The SW-1000 Series is a 3D surface measurement system that integrates three optical methods: confocal, white-light interferometry and focus variation. Each method addresses different reflection characteristics, roughness, slopes and height changes, allowing ultra-smooth mirrors, conventional precision surfaces, rough metals, thin-film steps, grooves and complex microstructures to be measured on the same platform.
Users can select measurement paths based on sample condition and analysis goals, then complete area setup, data acquisition, tilt and shape correction, roughness calculation, step and profile analysis, and report output in unified software. Data from different methods enters the same analysis process, reducing time and result differences caused by switching devices, repositioning samples and repeating processing.
SW-1000 integrates confocal, white-light interferometry and focus variation into the same measurement platform. White-light interferometry focuses on ultra-smooth continuous surfaces and small height changes; confocal measurement suits conventional precision surfaces and microstructures; focus variation suits rough surfaces, steep slopes and larger height changes. Users can choose the appropriate method for the sample without configuring separate devices for different surfaces.
White light forms an interference signal after reflection from the reference optical path and the measurement optical path. A high-contrast zero-order interference peak appears only when the optical path difference is close to zero. The system records each pixel's interference response through Z-axis scanning, then uses ICA correlation processing to determine the height position of each pixel and form 3D surface data.
The system analyzes surface roughness, step height, grooves, micro-pillars and 3D profiles. After data acquisition, the software can perform tilt and macro-shape correction, then calculate roughness parameters, regional height differences, section dimensions and structural morphology from the surface height distribution.
For samples beyond a single field of view, the system can be used with a motorized XY platform to perform multi-point mapping acquisition and splice multiple local 3D data into a more complete surface result. Users can switch between overall flatness, regional topography and local details, suitable for wafer, glass, film, precision parts and other large flat samples.
The software connects measurement-area setup, optical-path and mode selection, data acquisition, noise processing, coordinate conversion, tilt correction, 2D/3D/profile analysis and report output in one process. Users can build measurement tasks around key areas and save images, 3D data, roughness, step and dimensional results.
The system obtains height information for each pixel in the measurement area through vertical scanning, then removes macro tilt and shape trends before analysis. After preprocessing, roughness parameters such as Sa, Sq, Sz, Ssk and Sku can be calculated from micro-height deviations and reviewed together with the 3D surface, 2D height map, profile and statistical results.
In white-light interferometry, the system captures the zero-order interference peaks of the lower and upper step planes and records the corresponding Z-axis positions. Through regional mean, profile or datum analysis, it can obtain the height difference of films, coatings, wafer structures and other fine steps.
The system can obtain macro and micro 3D morphology of the sample surface, then analyze grooves, micro-pillars, pits, bulges, wear and machining textures. Through coordinate conversion, tilt correction and area extraction, users can further obtain profile, size, volume and morphology results.
For samples that need larger-area coverage, the system can perform multi-point acquisition and mapping stitching through the motorized XY stage. Users can select key areas in the overview, continue with roughness, step, section and 3D analysis, and use the results for R&D records, quality review and report output.
SW-1000 is built around the Three-in-One Composite Measurement Head and can be configured with objectives, stages and expansion platforms according to sample size, surface condition, working distance, measurement area and automation requirements. The best combination is not defined by simple high or low tiers, but by the actual sample and measurement task.
The measuring head integrates three optical methods: confocal, white-light interferometry and focus variation. Users can choose a suitable path for mirror surfaces, conventional precision surfaces, rough surfaces, steep slopes and height changes, then complete analysis in unified coordinates and software.
Confocal · White-Light Interferometry · Focus VariationThe system can be configured with conventional objectives, long-working-distance objectives, achromatic objectives and interferometry-related objectives to adapt to different fields of view, space constraints, sample heights and surface measurement tasks. Objective scope and compatibility are subject to the official configuration plan.
Standard Objective · Long Working Distance · Interferometry ConfigurationThe motorized XY stage, wafer stage, tilt platform or large sample platform can be configured according to the sample size and measurement range, and the measurement area can be expanded through multi-point mapping. The specific stroke, load-bearing and splicing capacity are subject to the selected platform.
Motorized XY · Wafer Stage · Mapping StitchingFor multi-angle measurement, special tooling, heightened samples or automated inspection processes, project expansions such as five-axis measurement platforms, customized stages, triggering and data interfaces can be evaluated. Such capabilities are project configurations and are not standard by default for all equipment.
Five-Axis Platform · Custom Fixture · Automation InterfaceThe following content describes the main measurement methods, analysis capabilities and optional configurations of SW-1000. Specific accuracy, range, objective lens, platform stroke, measurement speed and environmental parameters are subject to the official specifications and project configuration.
| Configuration Item | SW-1000 Series |
|---|---|
| Measurement method | Confocal, White-Light Interferometry, Focus Variation |
| Main analysis | Surface Roughness, Step Height, 3D Profile, Section, Groove, Micro-pillar and Regional Topography |
| Roughness parameters | Supports Sa, Sq, Sz, Ssk, Sku and other parameters, the details are subject to software configuration |
| Data view | Two-dimensional height map, three-dimensional surface, profile and parameter results linkage |
| Large-area measurement | Support multi-point mapping and large-area stitching according to platform configuration |
| Objective configuration | Conventional, long-working-distance, achromatic and interferometry-related objectives, selected according to plan |
| Stage configuration | Motorized XY, wafer, tilt and customized platforms, selected according to project needs |
| Automated expansion | Five-axis platform, tooling, triggering and data interface, etc., evaluated by project |
Wafer surface roughness, film steps, trenches, micro-pillars and 3D morphology measurement for MEMS structures and packaging.
Tools, molds, sealing surfaces, grinding textures, machining roughness, wear and surface profile analysis of complex parts.
Height and roughness measurement for mirrors, optical components, ultra-smooth continuous surfaces, films and coating steps.
Solder joints, ceramic substrates, electrode sheets, coatings, corrosion, wear, rough metal and material surface 3D Analysis.
Submit the sample material, surface condition, structural height, measurement area and analysis target. Engineers will help determine the confocal, white-light interferometry, focus variation and platform configuration strategy.