SALANG SW-1000 SERIES

Three-in-One Measurement System SW-1000 Series

Confocal, white-light interferometry and focus variation cover 3D measurement tasks from ultra-smooth mirror surfaces to rough surfaces, steep slopes and complex microstructures. Choose the measurement method that fits the sample surface, structural height and analysis goal, then complete roughness, step-height, 3D profile and surface-feature analysis on the same platform.

Roughness Analysis Step Height 3D Profile

01 / Product Positioning

For different surfaces, choose the more suitable measurement method.

The SW-1000 Series is a 3D surface measurement system integrating confocal, white-light interferometry and focus variation. Each method addresses different surface reflectivity, roughness, slopes and height changes, allowing ultra-smooth mirrors, conventional precision surfaces, rough metals, thin-film steps, grooves and complex microstructures to be measured on one platform.

Users can choose the measurement method according to sample condition and analysis goals, then complete area setup, data acquisition, correction, analysis and report output in unified software. Data from different methods follows the same workflow, reducing the time and result differences caused by changing equipment, repositioning samples and repeating processing.

White-light interferometry: 3D topography and physical image of a fine-step sample
02 / Three Measurement Principles

How different optical methods obtain surface height.

White-light interferometry, laser confocal and focus variation locate the sample surface along Z through different signal responses, then reconstruct a 3D surface from the height position of each pixel.

  1. Reference lightand measurement light
  2. Z-axis scan
  3. Interference response
  4. Peak localization
  5. 3D surface
White-light interferometry surface-height measurement principle animation White light is split into reference and measurement beams. The system scans along Z and records interference oscillations with a local envelope, determines pixel height at the envelope peak, and forms a 3D surface. White light Beam splitter Reference surface Sample Z Interference response Reference light Measurement light Z-axis scan Interference peak Height position 3D surface
03 / Roughness, Steps and 3D Profile

Visualize topography, quantify data.

The system analyzes surface roughness, step height, grooves, micro-pillars and 3D profiles. After data acquisition, the software corrects tilt and macro shape, then calculates roughness parameters, regional height differences, profile dimensions and structural topography from the surface height distribution.

White-light interferometry measurement result
04 / Multi-Point Measurement and Mapping Collection

From a single point to multiple points, complete Mapping measurement

Working with a motorized XY platform, the system automatically measures multiple positions on a sample and records each position with its result for multi-region Mapping acquisition and comparison. It is suitable for wafers, glass, films, precision parts and other tasks requiring repeated measurements at multiple locations.

05 / Software Workflow and Result Output

From sample placement to verifiable measurement results.

The software connects measurement-area setup, optical-path and mode selection, data acquisition, noise processing, coordinate conversion, tilt correction, 2D / 3D / profile analysis and report output in one workflow. Users can build measurement tasks around key areas and save images, 3D data, roughness, step and dimensional results.

SW-1000 software workflow diagram
01 / Surface Roughness

Turn each set of height data
into an assessable surface result.

From surface-height acquisition and 3D data fusion to roughness and key-dimension calculations, the system performs continuous analysis around the same measurement dataset. Linked 3D, 2D and profile views make it easy to assess results from overall topography to local structures.

02 / 3D Profile

Reconstruct 3D topography
for precise analysis of complex structures.

The system captures macro- and micro-scale 3D topography of sample surfaces and analyzes grooves, micro-pillars, pits, protrusions, wear and machining textures. Coordinate transformation, tilt correction and regional extraction provide profile, dimensional, volume and topography results.

Models and Configuration

One measurement platform, choose the measurement head for the task

The SW series provides confocal, white-light interferometry and integrated measurement-head configurations for different surface measurement tasks. Choose the appropriate solution according to sample characteristics, accuracy requirements and measurement method.

SW-1000 equipment and platform configuration
SW-1000: Configurable around measuring heads, objectives, stages and project expansion combinations.
Three-in-One Measurement Head

SW-1200

Integrated confocal and white-light interferometry cover more surface measurement tasks with one measurement head.

Combines confocal and white-light interferometry capabilities, allowing the appropriate optical method to be selected based on the sample surface characteristics and measurement task, from conventional 3D topography to precision surface-height analysis on the same platform.

Confocal · White-Light Interferometry · Comprehensive Measurement

View SW-1200 Configuration
White-Light Interferometry Measurement Head

SW-1100

White-light interferometry for precision surface height and micro-topography.

Uses white-light interferometry to obtain 3D surface-height information. Suitable for non-contact measurement of fine height changes, steps, flatness and micro-surface topography, and can serve as a dedicated measurement extension for the SW platform.

White-Light Interferometry · Precision Height · 3D Topography

View SW-1100 Configuration
Confocal Measurement Head

SW-1000

Confocal measurement for complex surfaces and 3D profiles.

Uses confocal measurement to obtain surface height and 3D profile information, suitable for conventional precision surfaces, rough structures and samples with pronounced height variation, combining topography acquisition with 3D analysis.

Confocal · 3D Profile · Surface Measurement

View SW-1000 Configuration

Specifications

SW-1000 Three-in-One Measurement System brochure cover

Complete Product Information

Only core specifications are shown here. Get the full product brochure for complete selection details.

Download the product brochure for complete specifications, model configurations and product information.

  • Full Specifications
  • Model Configurations
  • Product Information

Core Specifications Comparison

The following shows the main models and core specifications.Swipe to view full specifications

Configuration Item SW-1000 Series
Measurement MethodConfocal, White-Light Interferometry, Focus Variation
Main AnalysisSurface Roughness, Step Height, 3D Profile, Sections, Grooves, Micro-pillars and Regional Topography
Roughness ParametersSupports Sa, Sq, Sz, Ssk, Sku and other parameters; details are subject to software configuration
Data ViewLinked 2D height map, 3D surface, profile and parameter results
Large-area MeasurementMulti-point Mapping and large-area stitching supported according to platform configuration
Objective ConfigurationConventional, long-working-distance, achromatic and interferometry-related objectives, selected according to the measurement plan
Stage ConfigurationMotorized XY, wafer, tilt and customized stages, selected according to project needs
Automation ExpansionFive-axis platforms, tooling, triggering and data interfaces, evaluated by project

Typical Applications

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Semiconductor and MEMS

Wafer surface roughness, film steps, grooves, micro-pillars, and 3D topography measurement for MEMS structures and packaging.

Precision Machining

Tools, molds, sealing surfaces, grinding textures, machining roughness, wear and surface profile analysis for complex parts.

Optics and Coatings

Height and roughness measurement for mirrors, optical components, ultra-smooth continuous surfaces, films and coating steps.

Electronics, New Energy and Materials

3D analysis of solder joints, ceramic substrates, electrode sheets, coatings, corrosion, wear, rough metals and material surfaces.