For semiconductor, precision manufacturing, materials research, new energy and quality inspection workflows, SALANG supports measurement tasks from microscopic morphology analysis to macro-scale dimensional inspection.
Choose the system that fits your sample, measurement target and workflow
SA-1000 Series
A high-precision non-contact system for 3D morphology, profile and step-height inspection.
SDM-1000 Series
Extended depth-of-field observation, microscopic imaging and image analysis for complex surfaces.
SLX-1000 Series
Integrated microscopic imaging, 3D analysis and multidimensional inspection for research and industrial workflows.
SW-1000 Series
An integrated system for surface roughness, step height and 3D morphology inspection.
Match sample requirements to suitable equipment
Clearly observe and quickly locate microscopic defects such as scratches, particles, burrs and cracks.
View All Testing CapabilitiesFind testing solutions matched to your industry workflow
For morphology, step-height and surface-defect inspection in wafer, packaging, TSV and thin-film processes.
View All ApplicationsFrom wafers to full glass panels, see the complete surface quickly.
SA-1000 supports large-area fast scanning: 300 × 300 mm in about 150 s, 400 × 400 mm in about 260 s, and 500 × 500 mm in about 350 s. It is suitable for rapid mapping and surface-defect localization on wafers, glass, films, electrodes and other large flat samples.
View ProductRough surfaces, mirror surfaces and step surfaces can be handled on one platform.
The system integrates confocal, white-light interferometry and focus-variation methods. Confocal measurement suits surfaces from smooth to rough; interferometry suits ultra-smooth continuous surfaces and ultra-fine step heights; focus variation covers steep slopes and larger vertical ranges. Measurement angle can reach up to 86°. Measurement noise can be as low as 80 pm / 0.08 nm for 3D morphology, step height, roughness and flatness analysis.
View ProductUneven surfaces can be seen clearly in one view.
With 360° illumination information and DPC algorithms, small surface relief features are rendered with a near-SEM three-dimensional effect. Combined with 4K CMOS imaging and telecentric high-resolution optics, it provides clearer observation of fractures, burrs, solder joints, rough surfaces and similar samples.
View ProductMultiple observation methods for multiple application scenarios.
SLX integrates brightfield, darkfield, polarization, metallography, biological, fluorescence, 3D morphology imaging and panoramic tile scanning on one platform. For metallographic structures, semiconductor samples, fluorescent specimens, coatings or composite materials, users can switch between observation tasks without frequently changing systems.
View ProductMake precision measurement reliable in everyday work.
SALANG focuses on precision optical measurement and microscopy analysis. By developing optical systems, precision motion control, imaging algorithms and analysis software together, SALANG turns complex microscopic information into clear, stable and decision-ready inspection results.
We start from real samples and practical tasks, continuously validating equipment performance in R&D, quality inspection and production environments so each system can not only measure, but also fit reliably into daily workflows.
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